Fill the Void. Save Your Circuits.

Manufacturers are facing a major issue: voiding.

Voiding occurs when pockets of gas become trapped within the solder joint during the reflow process. This can lead to a reduction in solder joint reliability, an impedance of thermal transfer, and an increase in mechanical failure. Simply reworking solder joints would be too difficult or time-consuming for complex electronic assemblies and may potentially stress nearby components thermally.

There is much debate about how much voiding is acceptable – but one thing’s clear: the fewer voids, the better.