PCBA RISK MITIGATION THROUGH SOLDER PASTE AND FLUX BEST PRACTICES

We are proud to share that Tony Lentz, FCT Solder FAE, is the featured speaker in a webinar on Tuesday, June 9th at 10:00 AM (Pacific Time). Free pre-registration is required! 

This presentation focuses on solder paste flux, liquid flux and wire solder fluxes and how their usage and the ingredients can affect PCBAs. If no clean fluxes are partially cleaned then the flux ingredients can pose a risk similar to un-washed high activity water soluble fluxes. Rework of solder joints increases the intermetallic layer thickness which can lead to mechanical fractures. Voiding in solder joints can lead to failures due to over-heating and mechanical fractures. Recommendations to mitigate risk will be given in the form of best practices for use of solder pastes and fluxes.

Tony has worked for FCT Companies since 1999 and currently focuses on field applications and R&D. For more information on this topic, reach out to our industry expert!

Tony Lentz can be reached here: [email protected]
Learn more about him on his LinkedIn page