Save Your Circuits.
Fill the void.
Manufacturers are facing a major issue: voiding.
Voiding occurs when pockets of gas become trapped within the solder joint during the reflow process. This can lead to a reduction in solder joint reliability, an impedance of thermal transfer, and an increase in mechanical failure. Simply reworking solder joints would be too difficult or time-consuming for complex electronic assemblies and may potentially stress nearby components thermally.
There is much debate about how much voiding is acceptable – but one thing’s clear: the fewer voids, the better.
Fill out the form to receive a free download of our white papers to:
- Learn effective methods for minimizing voids.
- Understand the reduction of voiding on an expanded set of variables.
- Discover proven combinations of mitigation strategies.
- Determine how voiding reduction applies to multiple solder pastes.
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