HOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY?

Printing of solder paste and stencil technology has been well studied and many papers have been presented on the topic. Very few studies have looked at how solder paste volume affects solder joint reliability. It is the aim of this work to correlate printed solder paste volume to solder joint reliability. Speaker: FCT Field Application Engineer, Tony Lentz

About Tony Lentz

Tony Lentz has worked in the electronics industry since 1994. He worked as a process engineer at a circuit board manufacturer for 5 years. Over the last 14 years, Tony has worked for FCT as a chemical laboratory manager and facility manager. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Tony has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in Chemistry.

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