AMP One Ultra Low Voiding Solder Paste
The AMP One solder paste from FCT Solder, is redefining the voiding standard for PCB Assembly. By combining industry low levels of voiding performance with excellent activity and decreasing the potential for solder balling and graping, AMP One delivers assemblers an unmatched ability to amplify their process window while ultimately achieving higher yields.
Quarantech Tuesday: FREE Webinar Series
Join SMT Experts as we discuss common assembly defects, yield issues, and simple solutions to enhance every assembly process. Back by popular demand, we are rebooting our “SMT Nano-Coatings, Breaking the Longevity Barrier” webinar. Tune in on February 2, 2021 at 2:00 PM EST to learn more about impressive findings regarding upgrades to the longevity of NanoSlic Gold. Save your spot!
WIL-1 is a VOC FREE low activity and solids, no-clean, wave soldering flux. It is designed to make the transition from tin-lead to lead-free wave soldering as efficient and profitable as possible. WIL-1 provides best-in-class productivity combining extremely high electrical reliability with excellent solderability, ultra-low residue, and no white residues. It also boasts no copper greening and superior top-side hole-fill.
LF-C2 High-Reliability Solder Paste
Because of its creep-resistant properties, FCT Solder’s LF-C2 alloy is a common choice for underhood applications that have high operating temperatures. Thermal cycling weakens solder joints over a product’s life cycle. That, in turn, leads to vibration and shock issues. LF-C2 alloy’s strength creates high-integrity solder joints that hold up during harsh conditions.