FCT Assembly manufactures and sells high performance lead-free solder pastes for electronics assembly. Read more about our solder paste here.
FCT Solder FAE, Tony Lentz, is part of an upcoming FREE discussion panel. Register to join in on October 6 at 10:45 AM EST to learn about advanced print and paste deposition techniques. Achieving 100% paste volume in the print process directly correlates to solder joint reliability. This panel will discuss the do’s and don’ts […]
We are excited to announce a new technical webinar series, Quarantech Tuesday! The webinar episodes, co-hosted by FCT Solder and BlueRing Stencils, have SMT Experts on the show to share their knowledge and answer any questions you may have in real-time. Tune in every other week as we discuss common assembly defects, yield issues, and […]
We are proud to share that Tony Lentz, FCT Solder FAE, is the featured speaker in a webinar on Tuesday, June 9th at 10:00 AM (Pacific Time). Free pre-registration is required! This presentation focuses on solder paste flux, liquid flux and wire solder fluxes and how their usage and the ingredients can affect PCBAs. If […]
COVID-19 Update – March 18th, 2020 At FCT Solder, the safety and well-being of our employees and our customers is always our priority, and we recognize the important role we play in providing our customers with supplies and services during this critical time. We are actively monitoring the COVID-19/Coronavirus situation and taking steps to help […]
Listen to “Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction” on Spreaker. Tune in to Episode 32 of Mike Konrad’s podcast Reliability Matters! FCT Assembly Field Application Engineer, Tony Lentz, and BlueRing Stencils Manager of Stencil Technology, Greg Smith, were recently featured as special guests on this […]
We’re excited to share that FCT Assembly engineer Tony Lentz has been published in the latest Journal of SMT! “Fill the Void III” is the third in a series* exploring voiding (or gaps) in solder joints between circuit boards and components and expands on how to reduce voiding. Using specially designed circuit boards with components […]
Stencil design files are typically created along with the circuit board designs. The stencil aperture sizes are often the same size as the copper pads (1:1). If solder paste was printed using these aperture sizes, then issues could occur such as solder balling or bridging. It is common practice to reduce the stencil aperture size […]
There are many solderable surface finishes used on printed circuit boards. These surface finishes are necessary to protect the copper pads from oxidation and corrosion. Copper oxidizes very quickly and the oxide thickness grows over time. Copper oxides are very difficult to solder to especially with low activity no-clean fluxes. Solderable surface finishes protect the […]
Solder paste can be made with a variety of solder powder sizes. Solder powder sizes are classified by Type in the IPC standard J-STD-005 Requirements for Soldering Pastes. Table 3-2 details the solder powder size ranges for each type, and an excerpt from the table is shown below*. *IPC J-STD-005A Requirements for Soldering Pastes, […]