Fill the Void III: Paper on Voiding in Solder Joints Published in Journal of SMT
We’re excited to share that FCT Assembly engineer Tony Lentz has been published in the latest Journal of SMT!
“Fill the Void III” is the third in a series* exploring voiding (or gaps) in solder joints between circuit boards and components and expands on how to reduce voiding. Using specially designed circuit boards with components that are susceptible to voiding, Tony studied how solder powder size, certain alloys, surface finish, low voiding no-clean solder paste (using our AMP One Ultra Low Voiding Paste), and stencil designs impact voiding.
In the article, he shares specific recommendations that are helpful to anyone needing to minimize voiding. He also discusses some of the trade-offs involved to help readers make the best decisions for their applications. It’s valuable information to help engineers and manufacturers create higher-quality products.
Inclusion in the Journal of SMT, a peer-reviewed technical journal, is an honor for engineers in the electronics assembly industry. You’ll find the full study on page 13 of SMTAnews & Journal of Surface Mount Technology.
Tony has worked for FCT Companies since 1999 and currently focuses on field applications and R&D. This paper is the latest in a long career of relevant, forward-thinking research and publications within the industry.
*If you’re interested in reading part I and part II of our “Fill the Void” series, click here.